Copper HVOF 20-63 µm is a high-purity, chemically homogeneous powder designed for reliable performance in thermal spray applications. Its spheroidal particle shape ensures smooth and consistent feeding. This material is ideal for coating copper-alloy components, improving electrical conductivity, and providing effective EMI/RFI shielding.
Key facts:
Powder designed for:
Element Weight %
Cu min. 99.80
Other max. 0.20
Nominal particle size (SIA): 20-63 μm.
d10 min : 20 µm
d90 max : 65 µm
Apparent Density: ASTM B212, >4.80 g/cm3
Other tailored PSDs available upon request.