Pure Copper T-Spray (99.80%)
HPure Copper T-Spray is a high-purity, chemically homogeneous powder designed for reliable performance in thermal spray applications. Its spheroidal particle shape ensures smooth and consistent feeding. This material is ideal for coating copper-alloy components, improving electrical conductivity, and providing effective EMI/RFI shielding.
Key facts:
- High purity
- Smooth feeding (no satellites or agglomerates)
- High apparent density (min. 4.8 g/cm3)
Powder designed for:
- APS – Atmospheric Plasma Spray
- FPS – Flame Spray (powder)
Element Weight %
Cu min. 99.80
Other max. 0.20%
Nominal particle size (SIA): 38-90 μm.
d10 min : 38 µm
d90 max : 90 µm
Apparent Density: ASTM B212, >4.80 g/cm3
Tapped Density: ASTM B527, >6.10 g/cm3
Other tailored PSDs available upon request.